Failure Analysis

To employ various analytical techniques, we can assist clients to diagnose component failures due to contamination and material related issues. 

A person wearing protective laboratory clothing uses test probes to examine an electronic circuit board inside a controlled lab environment.

Our services

  • Optical Microscope Examination
  • Scanning Electron Microscope Examination (SEM/EDX)
  • Foreign Material Identifications
  • Micro-metrological measurements including
    • Step Height Measurement
    • Flatness Measurement
    • Roughness Measurement
    • 3D Microscopic Imaging
  • Microscope FT-IR Analysis (Fourier-transform infrared)
  • Cross sectional